Highly heat-resistant double-sided silicone tape, coated with reusable silicone resin and heat-resistant silicone adhesive, provides different adhesive strengths on both sides.
Characteristics
Advantages and Features
Maintains excellent dimensional stability and uniform adhesive properties at a high temperature of 260℃
Minimizes volatile components at high temperatures and suppresses the generation of adhesive residue
Easy to remove contaminants from weak areas and can be used repeatedly multiple times
Optimized thermal expansion coefficient with jig material
Implementation of 6 levels of adhesion on weak surfaces (10 → 300gf/25mm)
Possible to develop low-adhesion products with a weak point of less than 10gf.
Application
SMT Process Reflow soldering process for FPC, Thin Rigid PCB, and Rigid-flex PCB
Flip Chip mounting process
Small component/module mounting and assembly process Camera module and vibration motor assembly process for smartphones Photo Detector IC assembly process MEMS microphone assembly process RF module process Wireless LAN and GPS module process LTCC and MLCC manufacturing process Acceleration sensor and gyro sensor assembly process Crystal oscillator assembly process
OLED packaging process
Display panel manufacturing process OLED module assembly process Touch Panel manufacturing process For polarizing film or when removing OLED panel protective film
Micro-polishing process for thin package substrate
Dicing process for LTCC substrates, CSP substrates, and inductor substrates
TSF & TSP
Peel adhesion of reusable silicone compound
Reusable Silicone Tape (TS)
Highly heat-resistant double-sided silicone tape, coated with reusable silicone resin and heat-resistant silicone adhesive, provides different adhesive strengths on both sides.
Characteristics
Advantages and Features
Maintains excellent dimensional stability and uniform adhesive properties at a high temperature of 260℃
Minimizes volatile components at high temperatures and suppresses the generation of adhesive residue
Easy to remove contaminants from weak areas and can be used repeatedly multiple times
Optimized thermal expansion coefficient with jig material
Implementation of 6 levels of adhesion on weak surfaces (10 → 300gf/25mm)
Possible to develop low-adhesion products with a weak point of less than 10gf.
Application
SMT Process Reflow soldering process for FPC, Thin Rigid PCB, and Rigid-flex PCB
Flip Chip mounting process
Small component/module mounting and assembly process Camera module and vibration motor assembly process for smartphones Photo Detector IC assembly process MEMS microphone assembly process RF module process Wireless LAN and GPS module process LTCC and MLCC manufacturing process Acceleration sensor and gyro sensor assembly process Crystal oscillator assembly process
OLED packaging process
Display panel manufacturing process OLED module assembly process Touch Panel manufacturing process For polarizing film or when removing OLED panel protective film
Micro-polishing process for thin package substrate
Dicing process for LTCC substrates, CSP substrates, and inductor substrates
TSF & TSP
Peel adhesion of reusable silicone compound
10gf/25mm
20gf/25mm
30gf/25mm
40gf/25mm
130gf/25mm
300gf/25mm
TSF20
TSF20LB
TSF20MB
TSF20B
TSF20HB
TSF20H2B
TSF20H3B
TSP20
TSP20L
TSP20M2
TSP20
TSP20HB
TSP20H2B
B : Black P : Porous
B : Black P : Porous
The information provided above is based on our general experience and is given in good faith. However, we cannot assume responsibility for factors that are beyond our knowledge or control.
The information provided above is based on our general experience and is given in good faith. However, we cannot assume responsibility for factors that are beyond our knowledge or control.
